Items where Author is "Keshavarz, Meysam"

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Szostak, Katarzyna M and Keshavarz, Meysam and Constandinou, Timothy G (2021) Hermetic chip-scale packaging using Au:Sn eutectic bonding for implantable devices. Journal of Micromechanics and Microengineering, 31 (9). 095003. ISSN 0960-1317

This list was generated on Sun Jul 7 14:16:05 2024 UTC.