Die Attach Assembly Process Tool Advancement

Die attach film (DAF) voids detection is one of the challenges during the introduction of non-conductive adhesives for integrated circuit products affecting production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amount of DAF voids is presented wherein the implementation of semi-auto grid lines generates more precise measurement and correct defect call-out. The tool is proposed as an alternative option for x-ray inspection that is found to be incapable in proper detection and accurate measurement of gaps and un-occupied area within the adhesive thickness that produces over estimation of production rejects.